I.C.T has recently partnered with a mid-sized electronics manufacturer to refine solder paste printing processes. Solder paste printing is a critical SMT step, and even minor deviations in parameters can lead to defects such as bridging or insufficient paste deposition.

Through a detailed assessment of Solder Paste Printing Parameters, the team identified issues in squeegee speed, pressure, stencil separation, and paste viscosity. Environmental factors including temperature and humidity were also optimized.

I.C.T provided on-site training, calibrating printers and demonstrating the use of AOI and SPC monitoring. Operators learned to make real-time adjustments, while engineers tracked performance metrics. The initiative resulted in improved print consistency, reduced defect rates, and enhanced overall production throughput.

The collaboration highlights the importance of precise parameter control and operator expertise, offering tangible benefits for both production efficiency and product quality in SMT assembly.