Jinsung Electronics, is revolutionizing the electronics industry with its advanced FPC and rigid-flex circuit board design. With over 50 clients worldwide, the company offers multilayer rigid-flex solutions, offering up to 20-layer configurations. Jinsung precision-engineered PCBs combine mechanical durability, miniaturization, and 3D flexibility to meet the demands of today's electronic innovations.

Key Features of Rigid-Flex & HDI PCB Solutions:
 Rigid-flex structures offer up to 20 layers, making them ideal for compact systems, supporting sequential layer buildup with advanced stacking technology.

 The integration of rigid and flexible sections in 3D circuits creates dynamic, bendable circuits, reducing the need for connectors and cables.

 The flexible areas of the device can withstand up to 150,000 bending cycles, making it ideal for wearables and foldable devices.

 The device supports laser-drilled vias as small as 0.1 mm, allowing ultra-dense BGA routing and fine-pitch layouts down to 0.4 mm.

 Miniaturization and space optimization involve eliminating FOB areas, allowing internal space for larger batteries or slimmer bezels.

 Embedding Technology (EPS/EDS) enables the integration of active/passive components within layers, enhancing performance and board thinning.

 HDI technology provides superior electrical and thermal performance, enhancing signal integrity, EMI/RFI protection, and reliability.

 The design capability for a single sideboard type is limited to a minimum pattern width/space of 45 ㎛ and a thickness of 0.05T.

 The double side should have a minimum width of 50 inches per space and a thickness of 0.11 inches.

 The HDI/rigid-flex multilayer is a versatile material with a total thickness of 0.25T-3.0T, offering support for laser and machine drilling.

If you are looking for a Korean HDI PCB manufacturer, you can find them at Jinsung Electronics.

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View more: High-Performance HDI and Flex PCB Manufacturer.