With the explosive growth of AI computing power, data centers are facing an unprecedented wave of upgrades. As the "power heart" of AI servers, the AC-DC front-end power supply design faces severe challenges: how to achieve higher power density, longer lifespan, and stronger reliability within limited space? This issue not only concerns technological breakthroughs but also directly determines the continuity and stability of AI computing power output.

YMIN Electronics, a leading domestic enterprise in the field of high-voltage capacitors, has leveraged its years of accumulated technical experience to launch the IDC3 series of high-voltage liquid-soldered aluminum electrolytic capacitors, providing an innovative solution tailored for AI server power supplies and successfully overcoming industry pain points.

I. Three Core Challenges in AI Server Power Supply Design

In the design of the AC-DC segment of AI server power supplies and data center main power supplies, engineers have consistently been troubled by three major challenges:

Capacity Dilemma Under Space Constraints: The space of a 1U rack-mount server is extremely compact, and traditional standard-size soldered capacitors often fall into a stalemate of "limited size and insufficient capacity." Achieving sufficient energy storage capacity within limited height has become a key bottleneck that high-power-density power supply designs must overcome.

Lifespan challenges in high-temperature environments: AI data centers typically operate under high temperatures, placing immense pressure on power supply thermal management. The lifespan of a 450V/1400μF capacitor at 105℃ directly impacts the long-term stable operation of the entire system.

Performance requirements under high-frequency trends: The widespread application of new power devices such as gallium nitride (GaN) and silicon carbide (SiC) has driven power supply switching frequencies to continuously rise to tens to hundreds of kHz (this article uses 120kHz as an example). This places higher demands on the equivalent series resistance (ESR) and ripple current withstand capability of capacitors to mitigate the risk of system downtime.

II. YMIN IDC3 Series: Reshaping the Performance Boundaries of High-Voltage Capacitors with Technology

To address the aforementioned challenges, the YMIN IDC3 series achieves comprehensive breakthroughs in material formulation, structural design, and manufacturing processes, providing precise solutions:

1. Density Innovation: 70% Capacitance Leap in Φ30×70mm Size
Utilizing a compact Φ30×70mm solder pad package, a high capacitance of 450V/1400μF is achieved within the typical height limitations of a standard 1U server power supply. Compared to traditional products of the same size, the capacitance is increased by over 70% (compared to the conventional capacitance range of Φ30×70mm, 450V liquid solder pad capacitors in the industry), perfectly resolving the contradiction between high capacitance density and space constraints.

2. High-Temperature Longevity Breakthrough: Stable Operation for 3000 Hours at 105℃
Through optimized electrolyte formulation and anode foil structure, the IDC3 series exhibits superior load life performance even under harsh operating conditions at 105℃. This design enables the capacitors to maintain long-term stability in the high-temperature environment of data centers, effectively solving the industry problem of shortened lifespan caused by high temperatures.

3. High-Frequency Adaptation Upgrade: Tailor-made for the GaN/SiC Era
Adopting a low ESR design, it can withstand higher ripple current at 120kHz, making it more compatible with high-frequency switching topologies based on GaN/SiC (meeting product specification requirements), providing strong support for improving the efficiency of high-power-density power supplies. Unlike traditional bus capacitors that focus on low-frequency ripple adaptation, high-power-density power supplies on GaN/SiC platforms must simultaneously meet the ESR and high-frequency ripple current requirements specified in the specification. The IDC3 series precisely matches this requirement.

Note: The core parameters in this article are all from the YMIN IDC3 series product specification/test report; unless otherwise stated, ESR, ripple current, and other indicators are described according to the specification standard (e.g., 120kHz), and the latest version of the specification shall prevail.

III. Collaborative Innovation: Reliability Verification in the 4.5kW-12kW Power Range

YMIN maintains deep technical collaboration with industry-leading GaN power semiconductor manufacturers such as Navitas (according to public information). In AI server power supply projects ranging from 4.5kW to 12kW and higher power levels, the IDC3 series high-voltage liquid-soldering aluminum electrolytic capacitors have demonstrated excellent performance.

This collaborative development model not only fully verifies product reliability but also lays a solid technical foundation for the continuous iteration and upgrade of AI server power supplies. Currently, the YMIN IDC3 series has become the preferred solution for several high-end AI server projects (according to public information), with performance comparable to leading international brands.

IV. Beyond Products: YMIN's AI Server System-Level Solutions

In the era of explosive growth in AI computing power, the reliability of power systems is paramount. YMIN Electronics deeply understands the stringent requirements of AI server power supply design and has created a complete solution through the IDC3 series that balances high capacity density, long lifespan, and high reliability.

The following is a typical selection reference for IDC3 series high-voltage liquid-soldered aluminum electrolytic capacitors in AI server power supplies, helping to quickly match system requirements:

V. Three-Step Selection Method: Quickly Match System Requirements

Select the rated voltage level (e.g., 450-500V) based on the bus voltage and with derating margin;

Determine the lifespan specification (e.g., 105℃/3000h) and evaluate temperature rise based on ambient temperature and thermal design scheme;

Match the product size (e.g., Φ30×70mm) according to space height and diameter limitations, while verifying ripple current and ESR indicators.

VI. Continuous Innovation: Injecting Stable Power into AI Infrastructure

In an era dominated by computing power, a stable power supply is the cornerstone of industrial development. YMIN Electronics, with its IDC3 series high-voltage liquid-soldered aluminum electrolytic capacitors at its core, continuously provides reliable capacitor support for AI computing infrastructure. We not only provide high-performance products, but also output system-level solutions based on deep technical understanding.

When you embark on designing next-generation AI server power supplies, YMIN is committed to helping you break through design boundaries with technological innovation, jointly riding the wave of computing power to achieve industrial upgrades.

Frequently Asked Questions

Q: How do YMIN IDC3 series high-voltage capacitors address the pain points of AI server power supplies?

A: The YMIN IDC3 series offers comprehensive solutions across three dimensions:

High-density design – Achieving 450V/1400μF high capacitance within a Φ30×70mm size, increasing capacity by over 70% for its size, resolving the core conflict between space and capacity;

High-temperature and long-life design – Optimized electrolyte and anode structure, achieving a load life of 3000 hours at 105℃, improving long-term system reliability;

High-frequency compatibility – Low ESR design supports 120kHz high-frequency operation, with a maximum ripple current of approximately 4.12A per unit (500V/1700μF, 120kHz), and approximately 2.75A for the 450V/1400μF specification (see selection table for details), adapting to GaN/SiC high-frequency topologies and facilitating high-power-density power supply designs.

Applicable Scenarios

AI server power supply AC-DC front-end design, data center main power systems, 1U high-density rack-mount server power supplies, GaN/SiC-based high-frequency switching power supplies, high power density (4.5kW-12kW+) AI computing power supplies

Core Advantages

Space Density: Achieves 450V/1400μF capacity in a Φ30×70mm size, over 70% improvement for the same size, adaptable to 1U server height limitations;

High Temperature Lifespan: Over 3000 hours of load life at 105℃, suitable for high-temperature data center conditions;

High Frequency Performance: Low ESR design, can withstand higher ripple current at 120kHz, compatible with GaN/SiC high-frequency topologies;

System Validation: Deep collaboration with manufacturers such as Navitas, adaptable to 4.5kW-12kW+ AI server power supply projects.