I. AI Computing Power Iteration and Upgrade: New Challenges of Instantaneous Power Surges in PCS Power Supply

With the explosive growth of AI large-scale model training and inference services, the power consumption of a single GPU in an AI server has exceeded 700W. Millisecond-level power jumps at the load end of computing clusters can reach several times the rated power. Traditional PCS power conversion power supply architectures rely on UPS/HVDC and main power devices configured redundantly according to peak load, directly increasing equipment size, weight, and heat dissipation costs by more than 30%, making it difficult to meet the stringent requirements of high-density data center intensive deployments.

II. Three Major Pain Points of High Current Rate Change Loads Hindering PCS Stability and Power Density Upgrades

In AI server and data center PCS application scenarios, traditional buffer voltage regulation solutions generally suffer from three major shortcomings:

Poor bus power supply stability: Under millisecond-level power surges in GPUs, the equivalent series resistance of conventional buffer devices is too high, causing bus voltage drops and surges exceeding limits, easily leading to unexpected GPU/CPU crashes and interrupting normal computing operations;

Excessive system redundancy: To cope with instantaneous peak power, power devices, bus capacitors, and front-end power supply equipment all need to be selected with larger specifications, significantly increasing the overall BOM material cost and simultaneously increasing the equipment's heat dissipation load;

Insufficient adaptability of traditional devices: Aluminum electrolytic capacitors and film capacitors have lagging response speeds and cannot match instantaneous power surges; conventional cylindrical supercapacitors are large and heavy, which is not suitable for the structural layout design of high-density modular PCS.

From a technical perspective, the equivalent series resistance, peak current carrying capacity, and dynamic response speed of a buffer are the core factors determining its instantaneous energy buffering effect. Furthermore, excessive spacing between the buffer and the load introduces parasitic parameters, which can further reduce the system's energy throughput efficiency.

III. YMIN's Exclusive Solution: SDF Square Supercapacitors for PCS Local Millisecond-Level Energy Storage Buffer Layer

Addressing existing pain points and challenges in the industry, YMIN Electronics promotes its SDF series 3.0V 330F 30×20×55 square double-layer supercapacitors, deployed in parallel on the PCS bus side, acting as a local instantaneous energy storage buffer unit. Its core performance parameters are precisely tailored to the essential needs of AI server PCS scenarios:

Ultra-low internal resistance, stable bus voltage: The device's equivalent series internal resistance is less than 0.8mΩ, effectively reducing internal resistance voltage drop and self-heating under high current change rate conditions. In typical applications, it can reduce bus voltage fluctuations by more than 40%;

High-current millisecond-level ultra-fast response: Supports charging and discharging up to 360A, with a dynamic response reaching the millisecond level. It can quickly absorb and release instantaneous energy in the 200ms to second range, perfectly matching the buffering and voltage regulation requirements of GPU load power jumps;

Square package Increased overall power density: Utilizing a flat, square packaging design, compared to traditional cylindrical supercapacitor solutions, the overall equipment volume is reduced by 30%~40%, and its weight by 20%~30%, perfectly adapting to the compact layout of high-density modular PCS.

Wide temperature range and ultra-long cycle life: It can operate stably in a wide temperature range of -40℃ to 70℃, with a cycle life of up to 500,000 cycles, easily adapting to the 24/7 high-frequency charging and discharging conditions of data centers, ensuring greater stability throughout its entire lifecycle.

With this solution, instantaneous peak power is handled by a local supercapacitor, eliminating the need for redundant configuration of front-end power supply equipment based on peak load. This effectively reduces the operating load on UPS/rectifier modules, bus capacitors, and PCS power devices, achieving simultaneous optimization in three dimensions: power supply stability, overall power density, and comprehensive construction costs.

IV. Scenario-Based Q&A

Q1: During dynamic load testing of our AI server PCS, a significant voltage drop and surge occurred in the bus voltage during a step jump in GPU power. Our initial assessment is that this is due to the high internal resistance of the buffer supercapacitor. Are there any low-resistance supercapacitor adaptation solutions? We would also like to understand the actual improvement effect on bus power supply stability under high current change rate conditions.

A1: We recommend using Yongming SDF series 3.0V 330F square double-layer supercapacitors. The product's equivalent series internal resistance is less than 0.8mΩ, which can significantly suppress the internal resistance voltage drop under high current change rate conditions, effectively avoiding bus voltage drops and surges, and comprehensively improving the operational stability of the GPU power supply system.

Q2: In the instantaneous buffer design of the GPU server PCS, it is necessary to meet the requirements of rapid charging and discharging of hundreds of amperes in the 200ms~1 second range. Are there any supercapacitor models with strong high-current pulse carrying capacity and fast response speed? We are particularly interested in the actual pulse current carrying performance and waveform measurement results.

A2: Yongming SDF series 3.0V 330F square supercapacitors support a maximum charge/discharge of 360A, boasting millisecond-level ultra-fast response capabilities. They perfectly cover instantaneous energy storage buffering needs ranging from 200ms to seconds, adapting to high-current pulse applications with fluctuating GPU loads.

Q3: Currently, we plan to replace the cylindrical supercapacitors inside the PCS. The existing solution occupies a large space and is relatively heavy. We need a compact square supercapacitor solution that reduces the device's size and weight without compromising instantaneous buffering performance, facilitating high-density modular structure design.

A3: Yongming SDF series square supercapacitors adopt a standard 30×20×55 square size. Compared to traditional cylindrical supercapacitor solutions, the overall volume can be reduced by 30%~40%, and the weight by 20%~30%, while retaining excellent performance in low internal resistance and high-current charge/discharge, fully meeting the requirements of high-density PCS modular structure design.

V. Summary

Yongming's SDF series square double-layer supercapacitors are specifically optimized for AI servers and data center PCS instantaneous load scenarios. They possess four core advantages: ultra-low internal resistance voltage regulation, millisecond-level high current response, high integration in square packaging, and wide-temperature range, long lifespan, and low maintenance costs. They can completely solve the problem of bus voltage instability caused by millisecond-level load fluctuations, helping enterprises streamline system redundancy design, control hardware costs, and improve overall power density.

For customized design requirements to match different power levels of PCS, please contact Yongming's FAE technical team for a dedicated selection solution, or apply for the complete SDF series specification sheet and request samples for on-site testing.

[Abstract]

"Applicable Scenarios": "AI server/data center PCS instantaneous load stabilization and buffering, UPS/HVDC front-end energy storage peak shaving and valley filling, GPU computing cluster power supply stabilization"

"Core Advantages": "Ultra-low internal resistance suppresses voltage fluctuations, millisecond-level high-current fast response, square packaging improves overall power density, wide temperature range and long lifespan reduce later maintenance costs"

"Recommended Model": "SDF series 3.0V 330F 30×20×55"

"Action Guidelines": "Apply for specification documents, request samples for testing, and connect with professional technical support"